Making a conductive article

ABSTRACT

A method of making a conductive article includes depositing on a substrate a metal nanoparticle composition having water, silver nanoparticles dispersed in the water and a water-soluble polymer having both carboxylic acid and sulfonic acid groups. The weight percentage of silver in the composition is greater than 10%. The metal nanoparticle composition is dried. The dried metal nanoparticle composition is converted to improve the electrical conductivity of the dried metal nanoparticle composition.

CROSS REFERENCE TO RELATED APPLICATIONS

Reference is made to commonly assigned, co-pending U.S. patentapplication Ser. No. ______, filed concurrently herewith, entitled“SILVER METAL NANOPARTICLE COMPOSITION” by Wang et al.; U.S. patentapplication Ser. No. ______, filed concurrently herewith, entitled“METAL NANOPARTICLE COMPOSITION WITH WATER SOLUBLE POLYMER” by Wang etal.; U.S. patent application Ser. No. ______, filed concurrentlyherewith, entitled “CONDUCTIVE ARTICLE HAVING SILVER NANOPARTICLES” byWang et al.; U.S. patent application Ser. No. ______, filed concurrentlyherewith, entitled “CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS” by Wang etal.; and U.S. patent application Ser. No. ______, filed concurrentlyherewith, entitled “MAKING A CONDUCTIVE ARTICLE HAVING MICRO-CHANNELS”by Wang et al., the disclosures of which are incorporated herein.

Reference is made to commonly assigned U.S. patent application Ser. No.13/746,346 filed Jan. 22, 2013 entitled “Method of Making Micro-ChannelStructure for Micro-Wires” by Lebens, et al and to commonly assignedU.S. patent application Ser. No. 13/746,352 filed Jan. 22, 2013 entitled“Micro-Channel Structure for Micro-Wires” by Lebens, et al, thedisclosures of which are incorporated herein.

FIELD OF THE INVENTION

The present invention relates to the composition and use of aqueoussilver nanoparticle dispersions.

BACKGROUND OF THE INVENTION

Silver nanoparticle materials have become increasingly important in manytechnologies due to silver's unique chemical stability, excellentelectrical conductivity, catalytic activity, and antimicrobial effect.Silver nanoparticle materials have found uses in microelectronics,optical, electronic and magnetic devices, sensors, especially inbiosensors, and catalysts. For example in the area of printableelectronics, silver nanoparticle dispersions have been widely regardedas the best candidates to form conductive traces by solution depositionprocesses. The solution processes permit a roll-to-roll process onflexible substrates at mild temperatures, which significantly reducescost. The excellent conductivity of silver makes it possible to formvery fine patterns (e.g., mesh or grid patterns) of conductivemicro-wires that are essentially transparent to the unaided eye.

The proposed solution processes of the prior art include inkjetprinting, micro-contact printing, flexographic printing, gravureprinting, and direct ink-wiring through fine nozzles onto a substrate.With flexographic and gravure printing processes, the typical wetcoverage (thickness) is on the order of a couple of microns, especiallyfor narrow micro-wires. In order to accomplish greater than 0.3 μm drycoverage, the metal particle concentrations in the inks has to begreater than about 15% by volume, which is equivalent to a greater than65% by weight.

For certain applications such as RFID tags, ink jet printing can be usedto generate features having of low aspect ratios, e.g. less than 0.5micron thick and greater than 50 microns wide. U.S. Pat. No. 8,227,022has disclosed the generation of conductive patterns using aqueous basedsilver nanoparticle inks with multi-pass ink jet printing (5 passes ormore) and sintering the printed patterns at temperatures of equal togreater than 150° C. The electrical resistivity generated at suchconditions is greater than 0.2 ohms/square. The requirement ofmulti-pass and the resultant poor conductivity are perhaps due to thelow weight percentage of silver nanoparticles in the inks and theparticular stabilizers used which could lead to poor curing of silvernanoparticles during sintering.

U.S. Pat. No. 7,922,939 discloses a silver nanoparticle ink compositionhaving a silver concentration of greater than 50% by weight andcontaining a first anionic polymer stabilizer having a molecular weightof at most 10,000, and a second anionic polymer stabilizer having amolecular weight of at least 25,000. The inks disclosed can beconsidered as a high viscous gel and have an elastic modulus valuegreater than the loss modulus value. Such inks are useful for depositionprocess such as direct ink writing. However the electrical conductivitygenerated by such ink compositions is limited after annealing at hightemperatures.

U.S. Pat. No. 7,931,941 discloses a method of making silver nanoparticledispersion using a carboxylic acid stabilizer having from 3 to 7carbons. Such dispersions can be sintered into conductive films at lowersintering temperatures. However the dispersions are not water reducibleand cannot be formulated into ink-jet inks.

Jung et al, Morphology and conducting property of Ag/poly(pyrrole)composite nanoparticles: Effect of polymeric stabilizers, SyntheticMetals 161 (2011) pgs. 1991-1995 discloses silver/polypyrrole compositenanoparticles prepared using poly(4-styrenesulfonic acid-co-maleic acid)sodium salt or poly(N-vinylpyrrolidone) as stabilizer. Theseformulations have low % Ag content, high ratios of stabilizer to silverand resistivities tens or hundreds of times higher than bulk silver.

WO2010/109465 discloses incorporating halide ions as a sintering agentinto silver dispersions or receivers to improve conductivity.

WO2009/081386 discloses a method for producing very dilute solutions ofsilver nanoprisms that are not suitable for electronic devices.

There are various forms of non-aqueous based silver nanoparticledispersions which have been described in the prior art. Some of them arecommercially available. For environmental and safety reasons, it ishighly desirable to have aqueous-based silver nanoparticle dispersions.For performance reasons, it is highly desirable that these aqueoussilver nanoparticle dispersions are colloidally stable, can be preparedat high concentrations with low viscosities, are water reducible withexcellent re-dissolution behaviors, and have excellent electricalconductivity after sintering.

SUMMARY OF THE INVENTION

In accordance with the present invention, a method of making aconductive article comprises:

depositing on a substrate a metal nanoparticle composition having water,silver nanoparticles dispersed in the water, and a water-soluble polymerhaving both carboxylic acid and sulfonic acid groups, wherein the weightpercentage of silver in the composition is greater than 10%;

drying the metal nanoparticle composition; and

converting the dried metal nanoparticle composition to improve theelectrical conductivity of the dried metal nanoparticle composition.

The method uses metal nanoparticle compositions that have goodstability, are easy to handle and have low viscosity even up to a silverweight percentage of 90%. The present method can provide highlyconductive silver traces. Deposition can be done using a variety ofprinting techniques.

Further advantages of the present invention will become apparent fromthe details that are provided below.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plot of the silver nanoparticle size distribution for anembodiment of the present invention;

FIG. 2A is a plot of the mean silver nanoparticle size of dispersions ofthe present invention as a function of the water soluble polymer tosilver weight ratio used in the reaction mixture;

FIG. 2B is a plot of size distribution index as a function of the watersoluble polymer to silver weight ratio used in the reaction mixture.

FIG. 3 is a plot of dispersion viscosity as a function of shear rate forvarious dispersions of the present invention;

FIG. 4 is a cross sections of a micro-channel according to an embodimentof the present invention;

FIG. 5 is a cross section of a micro-wire in a micro-channel accordingto an embodiment of the present invention;

FIGS. 6A-6C illustrate micro-wire patterns on a substrate according toan embodiment of the present invention; and

FIG. 7 is a flow diagram illustrating an embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

The aqueous silver nanoparticle dispersions of the present invention areprepared with a water-soluble polymer having both carboxylic acid andsulfonic acid groups. Such polymers can be prepared by variouspolymerization methods well known in the art. For example, they can beprepared by a free radical polymerization of a mixture of ethylenicallyunsaturated monomers which have a sulfonic acid side group andethylenically unsaturated monomers which have a carboxylic acid group.The polymers can also be prepared by a post modification of a pre-formedcopolymer which has one of the co-monomers with a carboxylic acid sidegroup. The sulfonic acid group is introduced by sulfonation of theco-monomer which does not have the carboxylic acid side group. Forexample, poly(styrenesulfonic acid-co-maleic acid) can be made by firstpolymerization of a monomer mixture containing both styrene and maleicanhydride to form poly(styrene-co-maleic anhydride), and subsequentsulfonation and hydrolysis of the pre-formed polymer.

The water soluble polymer having both carboxylic acid and sulfonic acidgroups can have various microstructures, such as, for example, randomcopolymer, block copolymer, and graft copolymer. The polymers can belinear, branched, and hyper-branched. The polymer can contain up to 10%of monomers which neither have neither sulfonic acid group norcarboxylic acid group.

Various ethylenically unsaturated monomers can be used to form thepolymers for use to make the silver nanoparticle dispersions of theinvention. Suitable ethylenically unsaturated monomers with sulfonicacid side group can include, for example, styrenesulfonic acid,3-sulfopropyl acrylate, 3-sulfopropyl methacrylate, 2-sulfoethylmethacrylate, 3-sulfobutyl methacrylate, 2-acrylamido-2-methylpropanesulfonic acid. Suitable ethylenically unsaturated monomers containingcarboxylic acid groups include acrylic monomers such as acrylic acid,methacrylic acid, ethacrylic acid, itaconic acid, maleic acid, fumaricacid, monoalkyl itaconate including monomethyl itaconate, monoethylitaconate, and monobutyl itaconate, monoalkyl maleate includingmonomethyl maleate, monoethyl maleate, and monobutyl maleate, citraconicacid, and styrenecarboxylic acid, 2-carboxyethyl acrylate,2-carboxyethyl acrylate oligomers.

Preferably the ratio of the sulfonic acid group to carboxylic acid groupranges from 0.05 to 5, preferably from 0.1 to 4, and most preferablyfrom 0.5 to 2. The molecular weight of the polymers is typically morethan 500 and less than 500,000, preferably less than 100,000, and mostpreferably less than 50,000. In certain embodiments, the carboxylic acidgroup is selected to stabilize the silver nanoparticle dispersion andthe sulfonic acid group is selected to lower the polymer-to-silverweight ratio in the final dispersion. In a preferred embodiment of thepresent invention, the water-soluble polymer having both carboxylic acidand sulfonic acid groups is poly(styrenesulfonic acid-co-maleic acid).

In another preferred embodiment of the invention, the water-solublepolymer having both carboxylic acid and sulfonic acid groups ispoly(styrenesulfonic acid-co-acrylic acid) having a molecular weight ofless than 20,000, and preferably less than 10,000. It has been foundunexpectedly that the silver nanoparticle dispersions with such polymerscan be made at 90% by weight or above and have low viscosities. Further,the silver nanoparticle dispersions made with such polymers can havesignificantly lower sintering temperature for electrical conductivitythan some of the other water-soluble polymers of the present invention.

The silver nanoparticle dispersions of the invention can be formed, forexample, by forming an aqueous mixture of the water soluble polymer anda reducing agent, and adding a source of Ag+, and growing the silvernanoparticles. Suitable reducing agents are typical agents that arecapable of reducing metals in aqueous systems, and include, for example,hydrazine, hydrazine hydrate, hydrogen, sodium borohydride, lithiumborohydride, ascorbic acid, formic acid, aldehydes, and amines includinga primary amine, a secondary amine, and a tertiary amine, and anycombination thereof. Suitable Ag+ source can be any water soluble silvercompound, for example, AgNO₃, CH₃COOAg, and AgClO₄. The reactiontemperatures can vary from room temperature to 95° C. Preferably thereaction temperature is above 60° C.

The water soluble polymer having both sulfonic acid and carboxylic acidgroups can be made into aqueous solutions with and without additionalbase. Various bases can be used, for example, ammonium hydroxide,lithium hydroxide, sodium hydroxide, potassium hydroxide, and the like.

Preferably the addition of the Ag+ source to the reaction mixture is bya continuous feeding process at a controlled rate. The stirring needs tobe optimized to have good mix for a desired particle size and sizedistribution. The total weight of Ag+ in the reaction mixture ispreferably above 5 wt %, and more preferably above 8 wt %. Highlyconcentrated and well dispersed silver nanoparticle dispersions can beprepared by purification of the reaction mixture with typical processesknown in the art, for example, settling, centrifugation, dialysis,sonication, and evaporation. The weight percentage of silvernanoparticle in the final dispersion is preferably above 10%, and morepreferably above 40%, and most preferably above 60%. Although an upperlimit for silver has not been found, the weigh percentage of silver inthe final dispersion does not usually exceed 90%. The viscosity of thedispersions at 60 wt % silver is preferably less than 100 centipoise,preferably less than 50 centipoises, and more preferably less than 20centipoise. In some particular embodiments, dispersions having a weightpercentage of silver in a range from 60 to 90% can advantageously have aviscosity of less than 100 centipoise, dispersions having a weightpercentage of silver in a range from 60 to 80% can advantageously have aviscosity of less than 50 centipoise and dispersions having a weightpercentage of silver in a range from 60 to 75% can advantageously have aviscosity of less than 20 centipoise. The surface tension of thedispersion is preferably above 50 dynes/cm, and more preferably above 60dynes/cm.

Depending on the application process, the concentrated dispersion can befurther formulated to include other addenda. For example, thermal inkjet printing normally requires the ink to have a viscosity of less than10 centipoises, and to contain various types of humectants, and possiblysurfactants.

In another embodiment of the present invention, a metal nanoparticlecomposition includes water with silver nanoparticles dispersed in thewater. The weight percentage of silver in the metal nanoparticlecomposition is greater than 70% and the viscosity of the composition isin a range from 10 to 10,000 centipoise. In particular, the weightpercentage of silver in the composition is advantageously in a range of70 to 90% and the viscosity of the composition is in a range from 10 to1000 centipoise. Alternatively, the weight percentage of silver is in arange of 70 to 80% and the viscosity of the composition is in a rangefrom 10 to 100 centipoise. Further, the weight percentage of organicsolids (see below) in such compositions is preferably in a range from0.05 to 3% by weight.

The mean size of the silver nanoparticles in the dispersion of thepresent invention ranges from 5 nm to about 500 nm. The particle sizecan be tuned by the amount of water soluble polymer used, the reactiontemperature, and the speed and method of agitation during reaction. Ingeneral, smaller particle size can be obtained by using a higher levelof the water soluble polymer in the reaction, or a lower reactiontemperature, or a slower stirring speed. The silver particle size canhave a bimodal size distribution. Particle size and aggregation canaffect the light absorption characteristics of the dispersions. Incertain embodiments, the composition has a light absorption spectrumhaving a wavelength absorbance maximum between 400 and 500 nm.

In a preferred embodiment, a significant amount of the water solublepolymer and any other water soluble organics are removed duringpurification processes after the reaction. The level of water solublepolymer and other organic species in the final dispersion can bedetermined by drying the dispersion at an elevated temperature (e.g. 40to 60° C.) under vacuum for more than 12 hours to remove water and lowvapor-pressure organics. The dried solids are then analyzed by thethermal gravimetric analysis (TGA) to obtain the total amount of“organic solids” which includes both the water soluble polymer and otherpossible residual organic compounds in the dried dispersion. Typically,the water soluble polymer comprises most of the mass of the organicsolids. The weight loss value at 700° C. is used to calculate thepercentage of organic solids in the dried dispersion. The remainingsolid matter is primarily silver. The “total solids” content of thedried dispersion is the sum of the organic solids and silver. In apreferred embodiment, the amount of organic solids for the dried silvernanoparticle dispersion of the invention ranges from 0.05% to 10% byweight relative to total solids. For applications such as conductiveelectrodes, the amount of organic solids is preferably from 0.05% to 4%by weight, preferably from 0.05% to 3% by weight, and most preferablyfrom 0.05% to 2% by weight. The weight ratio of water soluble polymer tosilver in the dispersions of the present invention is typically in arange from 0.0005 to 0.11. For applications such as conductiveelectrodes, this ratio is typically in a range from 0.0005 to 0.04,preferably 0.0005 to 0.03 and more preferably 0.0005 to 0.02. The lowerlimit of polymer to silver is to ensure that the silver nanoparticledispersions of the invention do not form hard aggregates during storageand can be re-dispersed very easily after long standing even at highconcentrations. In some useful embodiments, the weight ratio of thepolymer to silver is in a range of 0.008 to 0.1, or in a range of 0.008to 0.04, or in a range of 0.008 to 0.02. The upper limit is mostlydetermined by the types of applications. For the formation of conductivetraces, it is preferred that the ratio is as low as possible for goodelectrical conductivity after sintering.

The silver nanoparticle dispersions of the invention preferably have apH of from 3 to 10, more preferably from 4 to 9, and most preferablyfrom 5 to 8.

The silver nanoparticle dispersions of the invention can be formulatedinto various inks and coating formulations for various applications.Such inks and coating formulations can include various addenda, such aslubricants, polymer binders including polymer latexes and dispersions,solvents and humectants, surfactants, colorants including pigments,rheology modifiers, thickeners, adhesion promoters, cross-linkers,biological additives, other metal particles of various sizes, forexample, silver particles having size of greater than 500 nanometers,various oxide particles, or combinations thereof.

In a preferred embodiment of the invention, the silver nanoparticledispersions of the invention are used to make conductive inks to form aconductive article of any type on a substrate. There is no limit on thetype of deposition tools which can be used. For example, the silvernanoparticle dispersions of the invention can be made into ink jet inkswhich can be printed with any ink jet printing method such as thermalink jet, piezo ink jet, MEMS jet, continuous ink jet, and the like. Theconcentrations of the silver nanoparticle dispersions of the inventionfor applications by ink jet are preferably in the range of from 10 to40% by weight, more preferably in the range of from 15 to 35% by weight.For certain types of papers such Hammermill Tidal MP plain paper andKodak Ultra Premium Ink Jet Photopaper, the printed silver nanoparticledispersions of the invention become highly conductive just by drying atroom temperature. This is also true for most commercial papers whichhave a surface coating containing CaCl₂.

There is no particular limit on the types of substrates which can beused for practice of the present invention, and include, for example,plastic substrates such as polyesters, polycarbonates, polyimide, epoxy,vinyl, glass and oxide substrates and modified glass and oxidesubstrates, metal and modified metal substrates, and paper and modifiedpaper substrates, and the like.

The conductive inks including the silver nanoparticle dispersions of theinvention can be used for screen printing, flexographic, gravure,photo-pattern, pad printing, and other processing techniques.

With a substrate such as polyimide or glass, the printed silvernanoparticles after drying at low temperature may not have adequateelectrical conductivity. The dried silver nanoparticle composition canbe converted into a more conductive form by applying heat to aid insintering the silver. Preferably the sintering temperatures range from100° C. to 400° C. and preferably from 150° C. to 300° C. With plasticsubstrates such as polyester and polycarbonate, such a high heattreatment temperature may significantly deform the substrate. Instead alight source provided by, for example, a PulseForge tool by Novacentrixcan be used to expose the dried silver nanoparticles to improve itselectrical conductivity.

Alternatively, the dried silver nanoparticles can be converted into amore highly conductive form by exposure to a halide. Treatment withsolutions including an inorganic halide compound including, for example,sodium chloride, potassium chloride, hydrogen chloride, calciumchloride, magnesium chloride, sodium bromide, potassium bromide,hydrogen bromide, and the like. In a useful embodiment, the treatment isdone by using a halide vapor source such as HCl vapor at roomtemperature.

Alternatively, the halide can be provided in or on a substrate. Thesubstrates onto which the silver nanoparticle dispersions of theinvention are deposited can have a coated layer including a halidecompound such as calcium chloride.

In particularly useful embodiments, the substrate can include ahalogen-containing polymer, for example as a coated layer. Unlike halidecompounds that are ionic in nature, halogen-containing polymers includehalogen atoms that are covalently bonded to the polymer. Examples ofsuch polymers include both homopolymers and copolymers of vinyl chlorideand vinylidene chloride. The copolymers can be formed by polymerizingvinyl chloride or vinylidene chloride with generally less than 50%, orin other embodiments less than 30% or less than 20%, by weight of othervinyl monomers, such as styrene, acrylonitrile, butadiene, methylacrylate, ethyl acrylate, butyl acrylate, and the like. Preferably thecoating thickness of such halogen-containing polymers on a substrate isgreater than 0.5 μm, and more preferably greater than 1 μm. Undercertain environmental stresses, some halogen-containing polymers canbecome slightly yellow. Thus, in some embodiments, the coating thicknessof the halogen-containing polymer is advantageously less than 10 μm oreven less than 5 μm.

In a preferred embodiment of the invention, the layer containing thehalogen-containing polymer is formed by depositing an aqueous coatingsolution including a latex polymer comprising greater than 80% by weightof vinyl chloride or vinylidene chloride, and less than 10%, and morepreferably less than 5% of a water soluble monomer including, forexample, acrylic acid, methacrylic acid, itaconic acid, hydroxyethylmethacrylate, acrylamide, methacrylamide, and the like.

In another preferred embodiment of the invention, the layer including ahalogen-containing polymer is formed by coating an aqueous solutionincluding the latex and a water soluble polymer. The latex includes ahalogen-containing polymer. The water soluble polymer is preferablyselected from a group of nonionic water soluble polymers and copolymers,including, for example, poly(vinyl alcohol), poly(vinyl pyrrolidone),polyacrylamide, poly(ethylene oxide), hydroxyl methyl cellulose,hydroxyl ethyl cellulose, and the like. The layer can be cross-linked.

When exposing the silver nanoparticle composition to halide orhalogen-containing polymers, additional heating is not always necessaryto achieve high conductivity. However, in some instances it can beuseful to further include a heating step after or during the exposure tohalide or halogen-containing polymer. In these cases the heating isgenerally in a range of 40° C. to 120° C. When the substrate orsubstrate layer includes a halide or halogen-containing polymer, it ispreferred that the silver nanoparticle dispersion is provided in directcontact with the halide or halogen-containing polymer.

Dispersions of the present invention can be coated to form effectiveconductive articles. In particular, after conversion by heat or halideor halogen-containing polymer, the silver metal can have bulkresistivity of less than 5 times that of pure silver. Preferably whenmaking conductive articles, the dispersions of the present invention canform silver metal having a bulk resistivity that is less than 4 times,or even less than 3 times that of pure silver.

In a useful embodiment, the silver nanoparticle dispersions of theinvention are patterned to form grids, meshes or other micro-wirepatterns that have low apparent visibility, high transparency (forexample, greater than 80% in the visible light transmittance) and lowelectrical resistivity (for example, less than 15 ohms/square). Incertain embodiments, the micro-wires for forming transparent conductorsare between 0.5 μm and 8 μm in width and greater than 0.2 μm inthickness. Transparent conductors have many uses. For example, they canbe useful for EMI shielding and in photovoltaic devices. They are alsouseful for display industries to electrically switch light-emitting orlight-transmitting properties of a display pixel, for example in liquidcrystal or organic light-emitting diode displays, or to form touchscreens in conjunction with displays. In touch screen applications, theoptical transparency is limited by the width of conductive traces usedto form the conductive electrodes, the density and uniformity of theconductive traces. It is highly desirable to limit the width of theconductive traces to less than 5 μm. Various printing and replicationmethods can potentially be used to form such thin conductive traces.

In the present invention, a particularly useful technique is to formsuch fine conductive traces in micro-channels embossed in a substrate.Embossing methods are generally known in the prior art and typicallyinclude coating a polymer layer onto a rigid substrate. A pattern ofmicro-channels is then embossed (impressed) onto the polymer layer by amaster having a reverse pattern of ridges formed on its surface. Theconductive ink is coated over the substrate and into the micro-channels;the excess conductive ink between micro-channels is removed. Theconductive ink in the micro-channels is cured, for example by heating.

In an embodiment of the present invention referring to FIGS. 4, 5, and7, a method of making a conductive article 5 includes providing (Step100) a substrate 10 having a surface 12 with one or more micro-channels60 having a width W of less than 12 μm. Suitable substrates 10 known inthe art include curable polymer coatings formed on an underlyingsubstrate 40 of glass, metal, or plastic. SU8 is suitable curablepolymer that can be embossed to form a pattern of micro-channels. Asshown, in FIGS. 4 and 5, substrate 10 is formed on a rigid underlyingsubstrate 40, for example glass.

A composition 50 is provided (Step 105) over substrate 10 and in one ormore micro-channels 60. The weight percentage of silver in composition50 is greater than 70% and the viscosity of composition 50 is in a rangefrom 10 to 10,000 cps. Composition 50 is provided over the surface 12 ofsubstrate 10 and in micro-channels 60, for example by dip coatingsubstrate 10 into a reservoir containing composition 50 or curtaincoating composition 50 over substrate 10. Alternatively, a patterneddeposition method is used, for example using an ink jet device. However,inkjet deposition typically provides composition 50 not only inmicro-channels 60 but also over surface 12 of substrate 10, since inkjetdeposition does not have sufficient accuracy to form lines as small asthe embossed micro-channels 60.

Excess composition 50 is removed (Step 110) from surface 12 of substrate10, for example by wiping surface 12 of substrate 10. Suitable wipingdevices include flexible blades or a curved rotating absorbent surfacesuch as a cylinder. Composition 50 provided in micro-channels 60 is thendried and converted (Step 115), either in sequential steps or in onecommon step, for example by heating, to form a micro-wire in eachmicro-channel 60, as illustrated in FIG. 5.

The present invention is useful for micro-channels 60 having a widthless than 12 μm, 8 μm, or 5 μm and a depth D less than 10 μm. Applyingmethods of the present invention to micro-channels 60 of such dimensionsis useful since prior-art patterned deposition methods, such as inkjetare currently limited to, for example, line widths of 20 μm or more.

Furthermore, compositions 50 of the present invention are useful becausethey can be readily provided (e.g. by dip or curtain coating) intomicro-channels 60 of such size, where higher viscosity compositions suchas pastes are not readily coated with simple liquid coating processes,even with mechanical assistance such as might be provided with aconventional doctor blade. Moreover, mechanical coating methods forpastes can mar the surface 12. This can be especially true formicro-channel patterns that include intersecting micro-channels so thatany mechanical coating device wipes across micro-channel 60 in onedirection (for example along the length of micro-channel 60) and wipesacross another, different micro-channel 60 in a different direction (forexample across the width of micro-channel 60). Such a mechanicallyfacilitated coating method for high-viscosity material is thusparticularly problematic at micro-channel intersections wheremicro-channels 60 intersect at angles between and including 45 degreesand 90 degrees. Referring to FIGS. 6A, 6B, and 6C, micro-channelpatterns of substrate 10 having such angles include rectangular gridpatterns 52, offset rectangular patterns with alternately offset rows54, and diamond-shaped patterns 56.

The present invention provides advantages over the prior art. Higherpercentages of silver in cured inks provide improved conductivity andthe reduced viscosity enable improved distribution of conductive inkinto micro-channels. Prior-art pastes having conductive particles arenot readily distributed into fine conductive traces and, in particular,into patterns of micro-channels in which micro-channels intersect witheach other.

In another useful application of the present invention, the metalnanoparticle composition is deposited onto a substrate by firstproviding the metal nanoparticle composition onto upper areas of arelief pattern (e.g. a flexographic plate), followed by contacting therelief pattern to the substrate in order to transfer the metalnanoparticle composition from the relief pattern to the substrate.

EXAMPLES Example 1 Preparation of the Silver Nanoparticles of theInvention Ag-dispersion-01:

To a 1000 mL three neck flask was added, at 90 C and under N₂, 40 g of a20% aqueous poly(4-styrenesulfonic acid-co-maleic acid), Na⁺ salt (1:1molar ratio of sulfonic acid to maleic acid, 20,000 MW) solution and 240g of a 50% aqueous diethanolamine solution. 120 g of a 54.75% aqueousAgNO₃ solution was added drop wise over 150 minutes. The reactionmixture was stirred overnight before cooled down to room temperature.The solution was then sonicated for 20 minutes and permitted to settle.After the supernatant was decanted off, the concentrated product wasdialyzed overnight and then centrifuged for 2 hours at 7000 rpm. Theresultant slurry was then re-dispersed in water, sonicated, and filteredthrough a 1 μm filter. The prepared silver nanoparticle dispersion had atotal solids content (organic solids plus silver) of about 49.6 wt %.The particle size and size distribution was analyzed by the AnalyticalDisc Centrifuge and had a particle size of 57 nm. The size distributionis shown in FIG. 1.

The resultant dried dispersion was analyzed by TGA at 700° C. in air forthe amount of organic solids. Based on this analysis, the resultantAg-dispersion-01 had 1.83% by weight of organic solids. The overallweight percentage of silver in the dispersion was about 48.7%.

Although the Ag-dispersion-01 was prepared using a weight ratio ofpoly(4-styrenesulfonic acid-co-maleic acid), Na⁺ salt to Ag of 20% inthe reaction, the final dispersion has a much lower content of the watersoluble polymer, as evidenced by the thermal gravimetric analysis above.

Ag-dispersion-02 through Ag-dispersion-06:

Ag-dispersion-02 through Ag-dispersion-06 were made in a similar mannerto Ag-disperion-01 except having a reaction weight ratio ofpoly(4-styrenesulfonic acid-co-maleic acid), Na⁺ salt to Ag at 5%, 10%,15%, 25%, 30%, and 40%. The resultant particle size and sizedistribution from the Analytical Disc centrifuge is shown in FIGS. 2Aand 2B as a function of the water soluble polymer to Ag weight ratioused in the reaction. The geometric size distribution is calculated byfirst calculating the fractional mass distribution as a function of theparticles size from the detector signal. Integrating the fractional massfor a given size range gives the total particle mass within that range.The apparent Stokes equivalent spherical diameter of the particles iscalculated from the sedimentation time. It is the equivalent diameter ofa hard sphere with the same density having the same sedimentation timeas the measured particles. The resulting particle size distribution is aplot of mass fraction as a function of apparent Stokes equivalentspherical diameter.

Ag-dipersion-07:

Ag-dipersion-07 was made in a similar manner to Ag-disperion-01 exceptusing poly(4-styrenesulfonic acid-co-maleic acid), Na⁺ salt (3:1 molarratio, 20,000 MW) solution as the water soluble polymer at 20%concentration relative to silver in the reaction mixture. The resultantdispersion had a total solids content of about 27.8% by weight, and meanparticle size of about 60 nm. The resultant dried dispersion wasanalyzed by TGA at 700° C. in air for the amount of organic solids.Based on this analysis, Ag-dispersion-07 had 1.47% by weight of theorganic solids. Thus, the overall weight percentage of silver in thedispersion was about 27.4%.

Ag-dipersion-08:

A poly(4-styrenesulfonic acid-co-acrylic acid) (1/1 by weight) polymerwas made in a 67/33 water/IPA mixture by free radical polymerization at70° C. Thiol glycerol was used as the chain transfer agent. After IPAwas removed by evaporation, the solution was extracted with MEK toremove the residual monomers. The MEK layer was separated and thepolymer solution was concentrated. The result weight percentage ofpolymer in the solution was about 45%. The polymer had a molecularweight of about 5900.

The polymer prepared was neutralized with ammonium hydroxide to a pHvalue of from 6 to 7. The resultant solution was used to prepareAg-dispersion-08 in a similar manner to Ag-disperion-01. The silvernanoparticle dispersion prepared had a mean particle size of about 46 nmand a total solids content of about 90% by weight. Even at this highpercentage of total solids, the solution did not gel and was still quitefluid and easy to handle. The resultant dried dispersion was analyzed byTGA at 700° C. in air for the amount of organic solids. Based on thisanalysis, Ag-dispersion-08 had 1.3% by weight of the organic solids.Thus, the overall weight percentage of silver in the dispersion wasabout 89%.

An ink was made at 60 wt % silver nanoparticles using the above silverdispersion by mixing it with 0.7% of a latex. The ink was drawn with aglass capillary tip to form liquid traces which are greater than 15 cmand less than 1.5 mm on a transparent polyester receiver surface havinga poly(vinylidene chloride) subbing layer. The trace was dried at 120°C. The electrical resistances were measured at 15 cm length and found tohave a value of about 85 ohms after 10 min drying, 50 ohms after 20 min,23 ohms after 60 min drying.

Example 2 Rheological Properties and Surface Tension of the SilverNanoparticle Dispersions of the Invention

Ag-dispersion-09 was prepared in a similar manner to Ag-dispersion-01except using a reaction weight ratio of poly(4-styrenesulfonicacid-co-maleic acid), Na⁺ salt to Ag at 12%. The resultant dispersionhad a total solids of about 83.5% by weight and a mean particle size ofabout 79.6 nm. The resultant dried dispersion was analyzed by TGA at700° C. in air for the amount of organic solids. Based on this analysis,Ag-dispersion-09 had 0.98% by weight of the organic solids. Thus, theoverall weight percentage of silver in the dispersion was about 82.7%.The rheology of the dispersion was measured at various percent solidsand the results are plotted as a function of shear rate in FIG. 3. Thefigure clearly demonstrates the advantages of the silver nanoparticledispersions of the invention. Even at high percentages of total solids,the viscosity of the dispersions are still well-below 100 cps. Thesurface tension of the dispersion was also measured at various percentof total solids (60 to 80 wt %) and was found to be in the range of from60 to 70.2 dynes/cm.

Example 3 Re-Dissolution Properties of the Silver NanoparticleDispersions of the Invention

One of the critical parameters for printing by the ink jet method isthat the inks after drying should have excellent re-dissolutionproperties to prevent ink jet nozzle from clogging. The Ag-dispersion-09prepared above was tested for this performance. The dispersion was driedunder vacuum at 50° C. overnight. The dried solids were re-dispersed inwater with slight agitation. It was found that the dried silvernanoparticles can be readily re-dispersed in water.

Example 4 Electrical Resistivity of the Silver Nanoparticle Dispersionsof the Invention by Ink Jet Printing on

The silver nanoparticle dispersion of the invention having a meanparticle size of about 58 nm was printed by the thermal ink jet methodusing Kodak ink jet head on the Kodak Ultra Premium Ink Jet Photopaperat two different total solids levels: 17.5 wt % and 30.9 wt %. Theprinting was done single-pass respectively at 2400 dots, 1200 dots, and600 dots per inch (DPI). The printed image was about 15 cm long and0.2136 cm wide. The samples were dried at room temperature overnightafter printing. The electrical resistance of each sample was measured.The results were converted to and presented as ohms/sq (Table 1). Thethickness of the printed images was calculated by mass balance. Thecalculated result was also confirmed by SEM cross-section measurement.The bulk resistivity of the resulted image was then calculated andcompared with pure Ag (see Table 1).

TABLE 1 Ink Total Solids 30.9% 30.9% 30.9% 17.5% 17.5% 17.5% DPI 24001200 600 2400 1200 600 Thickness (micron) 0.72 0.36 0.18 0.32 0.16 0.08ohms/sq 0.070 0.120 0.294 0.164 0.330 0.868 Bulk resistivity 5.06 4.355.32 5.25 5.29 6.95 (μΩ · cm) Ratio to bulk Ag 3.2 2.7 3.3 3.3 3.3 4.4resistivity

The above Ag dispersion was also printed a single pass on Hammer MillTidal MP paper, and on a polyester substrate which was coated with alayer comprising poly(vinyl alcohol), CaCl₂, and2,3-dihydroxy-1,4-dioxane cross-linker. The results are tabulated inTable 2.

TABLE 2 Ink Total Solids 30.90% 30.90% 17.50% 17.50% Drying ConditionOvernight 115° C./ Overnight 115° C./ room temp 10 min room temp 10 minSubstrate DPI Ω/sq Ω/sq Ω/sq Ω/sq Polyester 1200 2.17 0.47 Not Notconductive conductive 2.03 0.44 Not Not conductive conductive 2400 0.460.13 4.36 2.23 0.43 0.11 3.40 1.81 4800 0.19 0.06 0.50 0.28 0.23 0.080.48 0.24 Hammer Mill 1200 6.47 2.49 8.24 5.04 2.77 1.48 3.81 2.64 24000.29 0.24 0.99 0.80 0.25 0.20 0.70 0.57 4800 0.11 0.09 0.44 0.37 0.100.08 0.29 0.29

The above Ag dispersion at 30.9 wt % total solids was also printedsingle-pass at 2400 DPI on various low cost papers such as New Page BookDIJ (digital ink jet), New Page Mill Trial No. 110 made by New Page, andIPDSL (international paper data speed laser) Inkjet w/image lok. Theprinted ink was dried overnight at room temperature and then at 110° C.for 10 minutes. The results are tabulated in Table 3.

TABLE 3 Overnight 115° C./10 min RT (Ω/sq) (Ω/sq) New Page Book DIJ 1.121 New Page Mill Trail 0.31 0.26 No110 IPDSL Inkjet w/image lok 0.52 0.43

The above results clearly demonstrate that the silver nanoparticledispersions of the invention can be printed by the thermal ink jetprinting on various substrates to have excellent electrical conductivitywith just single-pass printing. The excellent ink printing propertiesare primarily due to the lower viscosity of the inks at high percentagesolids since it is well known in the art that thermal ink jet can onlyreliably printing inks with an ink viscosity of less than 3 to 5 cps andhaving excellent re-dispersion behaviors.

Example 5 Electrical Resistivity of the Silver Nanoparticle Dispersionsof the Invention on Substrates with Various Ink Receiving Layers

A transparent polyester film having a thickness of about 100 microns wascoated with ink receiving layers having compositions shown in Table 4. Asilver nanoparticle dispersion as prepared in a similar manner toAg-disperion-01 except the reaction temperature was at 70° C. The silvernanoparticle dispersion prepared had a bimodal size distribution withthe peak sizes being located at 63 and 139 nm. An ink was made from thedispersion and had a total solids of about 40 wt %. The ink was drawnwith a glass capillary tip on the receiver surface to form liquid traceswhich are greater than 15 cm long and less than 1.5 mm wide. Twoseparate traces were drawn on each receiver surface. The ink was driedat 120° C. for 10 min. The electrical resistance was measured at 15 cmdistance. The results are reported as ohms per 15 cm length and areshown in Table 5.

TABLE 4 dry coating weight Receiver in mg/ft² and Example Composition in[mg/m²] A AQ55 (Eastman Chemical) 100 [9.3] B Poly(methyl acrylate-co-100 [9.3] acetoacetoxyethyl methacrylate- co-2-Acrylamido-2-methyl-1-propanesulfonic acid) (90/7/3) C Sancure 898 (Lubrizol) 100 [9.3] DNeorez R600 (DSM) 100 [9.3] E GH23 (Nippon 60/0.6Gohsei)/Dihydroxydioxane [5.6/0.56] (DHD) F poly(vinylidiene chloride-100 [9.3] acrylonitrile-co-acrylic acid) (VC-1) G Poly(methylacrylate-co- 100 [9.3] vinylidiene chloride-co-itaconic acid) (VC-2) HGH23/VC-1/DHD 40/60/0.4 [3.7/5.6/0.037] I GH23/VC-1/DHD 80/120/0.8[7.4/11/0.074] J GH23/VC-1/DHD 30/70/0.3 [2.8/6.5/0.028] K GH23/VC-1/DHD60/140/0.6 [5.6/13/0.056] L GH23/VC-2/DHD 40/60/0.4 [3.7/5.6/0.037] MGH23/VC-2/DHD 80/120/0.8 [7.4/11/0.074] N GH23/VC-2/DHD 30/70/0.3[2.8/6.5/0.028] O GH23/VC-2/DHD 60/140/0.6 [5.6/13/0.056]

TABLE 5 Receiver Trace 1 Trace 2 Example (ohms) (ohms) A NC NC B NC NC CNC NC D NC NC E NC NC F 23.2 22 G 76 75 H 23 20 I 7.5 7.2 J 22 27 K 7.87.3 L 23.8 26.9 M 9.4 8.8 N 24.8 30.3 O 7.2 6.8

Receiver examples A through E were formed with organic polymerswell-known in the art, such polyester, acrylic polymer, polyurethanes,and poly(vinyl alcohol). These receivers do not includehalogen-containing polymers. Table 5 clearly demonstrates that the driedsilver nanoparticle ink is not conductive (labeled “NC”) when processedunder the above conditions. In contrast, receivers F through O wereformed with polymers which have chlorinated alkyl groups. The driedsilver nanoparticle inks of the invention on these receivers haveexcellent conductivity.

An ink was made of the silver nanoparticle dispersion as prepared in asimilar manner as Ag-dispersion-01 and had total solids of about 27.5%.The ink was printed by the thermal ink jet method using Kodak ink jethead on the receivers H through O. The printing was done single-pass at2400 DPI. The ink was dried at 115° C. for 20 min. The electricalresistance (ohms) was measured at 15 cm length. The height and width ofdried traces were measured by a contact profilometer. The surface andbulk resistivities were then calculated based on these measurements. Theresults are shown in Table 6.

TABLE 6 Ratio to pure Surface Bulk Ag bulk Ohms Width Height resistivityresistivitiy resist- Receiver 15 cm (cm) (μm) (Ω/sq) (μΩ · cm) ivity H23.8 0.057 0.576 0.091 5.21 3.28 I 19.3 0.051 0.494 0.066 3.25 2.04 J20.2 0.062 0.433 0.084 3.63 2.28 K 18.4 0.052 0.517 0.064 3.29 2.07 L33.1 0.046 0.730 0.101 7.39 4.65 M 22.8 0.045 0.596 0.068 4.05 2.55 N35.9 0.047 0.604 0.113 6.8 4.28 O 18.8 0.046 0.678 0.058 3.91 2.46

Table 6 clearly demonstrates that excellent conductivity can be achievedusing the halogen-containing polymer receiver compositions atsignificantly lower curing temperature.

Other comparative receivers were made by treating polyester surfacehaving a primer layer as disclosed in the WO 2010/109465 withpoly(diallyldimethylammonium chloride), poly(ethyleneimine), andcetyltrimethylammonium bromide, respectively. The above silvernanoparticle ink was then applied to these receivers and dried at 120°C. for 10 min. The dried silver traces were found not conductive.

Example 6 Electrical Resistivity of the Silver Nanoparticle of theInvention Wherein the Converting was Done by Exposing the Dried MetalNanoparticle Composition to a Halide Source

A silver nanoparticle ink was made by combining 15 grams of a silvernanoparticle dispersion prepared in accordance with the presentinvention having total solids of about 60.3% and a particle size ofabout 67 nm, 5.25 grams of a 2% hydroxyethyl cellulose thickenersolution, 0.55 grams of 1-butanol, and 1 gram of 1-propanol. The ink wasdrawn with an off-shelf glass pipet on a polyester receiver surface toform liquid traces. The liquid traces were dried at 120° C. for 10 min.

A series of treatment solutions were prepared mixed solvent to have anHCl concentration at 0.01, 0.005, 0.0025, 0.00125, and 0.000675N in80/20 water/isopropanol mixed solvent. Each treatment solution wastransferred to a spray bottle. The dried silver ink strips were thensprayed twice with the treatment solution and blotted the backside ofstrips on a paper towel. The silver ink strips were then dried at 120°C. for 2 min. The electrical resistance was then measured at 15 cmlength. The results are shown in Table 7

TABLE 7 Resistivity HCl (N) (ohms) 0.01 35 0.005 24 0.0025 74 0.00125239 0.000675 Not conductive

In the next experiment, the silver ink traces were prepared as aboveexcept that the dried silver ink traces were treated by HCl vapor. TheHCl vapor was formed by filling a glass desiccator with about 200 mL ofconcentrated HCl. A ceramic plate was placed above the HCl solution. Thesamples were placed on the top of the ceramic plate during treatment.The electrical resistance was measured at 15 cm length. The results areshown in Table 8.

TABLE 8 Time in HCl vapor Resistivity (sec) (ohms) 30 13.5 120 12 180 10500 10 600 11.5

COMPARATIVE EXAMPLES Comparative-Ag-01

Comparative-Ag-01 was prepared in a similar manner as Ag-dispersion-01except that poly(4-styrenesulfonic acid), sodium salt having a molecularweight of 70,000 was used as the water soluble polymer at a 20% weightratio to silver in the reaction mixture. It was observed that Agprecipitated completely out of the reaction solution to form films onthe side of glassware.

Comparative-Ag-02

Comparative-Ag-02 was prepared in a similar manner as Ag-dispersion-01except that poly(vinyl pyrrolidone) (PVP-15) was used as the watersoluble polymer at a 20% weight ratio to silver in the reaction mixture.It was observed that Ag precipitated completely out of the reactionsolution.

Comparative-Ag-03

Comparative-Ag-03 was prepared in a similar manner as Ag-dispersion-01except that poly(acrylic acid) (1800 MW) was used as the water solublepolymer at a 20% weight ratio to silver in the reaction mixture. It wasfound that the resultant dispersion was quickly settled out of thesolution.

Comparative-Ag-04

Comparative-Ag-04 was made in a similar manner as Ag-dispersion-01except that poly(styrene-maleic anhydride) (SMA17352 from Sartmer,neutralized with KOH) was used as the water soluble polymer at a 20%ratio to silver in the reaction mixture. The resulted dispersion hadtotal solids of about 38% by weight, a particle size of about 35 nm, andorganic solids of about 4.34% by weight as determined by TGA at 700° C.The dispersion was drawn with a glass capillary tip on a PET receiversurface having a gelatin subbing layer to form liquid traces which aregreater than 15 cm and less than 1.5 mm. The trace was dried at 120° C.and then treated with HCl vapor for about 2 min. The trace was foundnot-conductive.

Comparative-Ag-05

Comparative-Ag-05 was made in a similar manner as Ag-dispersion-01except that poly(benzyl methacrylate-co-methacrylic acid) (50/50, MW8500, neutralized with KOH) was used as the water soluble polymer at a20% weight ratio to silver in the reaction mixture. The resulteddispersion had total solids of about 43.6% by weight, a particle size ofabout 43 nm, and a total organic solids of about 6.46% by weight asdetermined by TGA at 700° C. The dispersion was drawn with a glasscapillary tip on a PET receiver surface having a gelatin subbing layerto form liquid traces which are greater than 15 cm and less than 1.5 mm.The trace was dried at 120° C. and then treated with HCl vapor for about2 min. The trace was found not-conductive.

The invention has been described in detail with particular reference tocertain preferred embodiments thereof, but it will be understood thatvariations and modifications can be effected within the spirit and scopeof the invention.

PARTS LIST

-   D depth-   W width-   5 conductive article-   10 curable/cured layer-   12 surface-   40 underlying substrate-   50 composition-   52 micro-channel grid pattern-   54 micro-channel offset grid pattern-   56 micro-channel diamond pattern-   60 micro-channel-   100 provide substrate step-   105 provide composition step-   110 remove excess composition step-   115 dry and convert composition step

1. A method of making a conductive article comprising: depositing on asubstrate an aqueous metal nanoparticle composition having water, silvernanoparticles dispersed in the water, and a water-soluble polymer havingboth carboxylic acid and sulfonic acid groups, wherein the weightpercentage of silver in the composition is greater than 10%; drying theaqueous metal nanoparticle composition; and converting the dried aqueousmetal nanoparticle composition to improve the electrical conductivity ofthe dried aqueous metal nanoparticle composition.
 2. The method of claim1 wherein converting includes heating the dried aqueous metalnanoparticle composition to a temperature in a range of 100° C. to 400°C.
 3. The method of claim 2 wherein the temperature range is from 150°C. to 300° C.
 4. The method of claim 2 wherein the heating is providedby a light source.
 5. The method of claim 1 wherein converting includesexposing the dried aqueous metal nanoparticle composition to a halide.6. The method of claim 5 wherein the halide is a chloride or a bromide.7. The method of claim 5 wherein the halide is provided by a vaporsource.
 8. The method of claim 5 wherein the halide is provided in or onthe substrate.
 9. The method of claim 5 wherein converting furtherincludes heating the aqueous metal nanoparticle composition to atemperature in a range of 40° C. to 120° C.
 10. The method of claim 1wherein converting includes exposing the dried aqueous metalnanoparticle composition to a halogen-containing polymer.
 11. The methodof claim 10 wherein the halogen-containing polymer is provided in or onthe substrate.
 12. The method of claim 11 wherein the halogen-containingpolymer includes polyvinyl chloride or polyvinylidene chloride or both.13. The method of claim 10 wherein converting further includes heatingthe aqueous metal nanoparticle composition to a temperature in a rangeof 40° C. to 120° C.
 14. The method of claim 1 wherein the substrateincludes a channel and the aqueous metal nanoparticle composition isprovided into the channel.
 15. The method of claim 1 wherein the aqueousmetal nanoparticle composition is deposited onto the substrate by firstproviding the aqueous metal nanoparticle composition onto upper areas ofa relief pattern, followed by contacting the relief pattern to thesubstrate in order to transfer the aqueous metal nanoparticlecomposition from the relief pattern to the substrate.
 16. The method ofclaim 1 wherein the aqueous metal nanoparticle composition is depositedonto the substrate by ink jetting.
 17. The method of claim 1 wherein thecarboxylic acid group is formed from acrylic acid, methacrylic acid,ethacrylic acid, itaconic acid, maleic acid, fumaric acid, monoalkylitaconate, monoalkyl maleate, citraconic acid, styrenecarboxylic acid,2-carboxyethyl acrylate or 2-carboxyethyl acrylate oligomers.
 18. Themethod of claim 1 wherein the polymer includes poly(4-styrenesulfonicacid-co-maleic acid) or poly(4-styrenesulfonic acid-co-acrylic acid).19. The method of claim 1 wherein the molar ratio of sulfonic acidgroups to carboxylic acid groups is in a range of 0.05 to
 5. 20. Themethod of claim 1 wherein the weight ratio of the polymer to silver isfrom 0.0005 to 0.04.
 21. The method of claim 1 wherein the weight ratioof the polymer to silver is from 0.0005 to 0.02.
 22. The method of claim1 wherein the aqueous metal nanoparticle composition further includes ahumectant, a surfactant, a latex polymer, a thickener, a colorant, across-linker or combinations thereof.